Semiconductor Device Modeling Group
The Semiconductor Device Modeling group of the MSCAD (Mixed-Signal Computer-Aided Design) Laboratory develops compact models for both low and high power semiconductor devices. Compact models are developed using Hardware Description Languages (HDLs) such as Verilog-A and MAST. These models are physics-based and they accurately describe the electrical and thermal behavior of the device without sacrificing the simulation speeds of application circuits based off of these models. Compact models help circuit designers evaluate their designs through high performance simulations using industry standard simulation engines such as Spectre, HSPICE, Saber, etc.
The Semiconductor Modeling Group’s efforts have involved silicon, silicon carbide and gallium nitride material systems. In some cases, research efforts have involved modifications to existing industry standard models such as BSIM3, BSIM3SOI, BSIM4, Mextram, VBIC, MM20, etc. In other cases, the models have been derived from physics principles and implemented in compact form using various techniques such as charge control, lumped-charge, and Fourier methods. Some models have utilized quasi-static approximations, while most demand a non-quasi-static formulation for adequately representing the charge distribution in a lightly-doped drift layer commonly found in power semiconductor devices.
Our group places an emphasis on device characterization and model parameter extraction from these experimental measurements. As such, all device models have a proven characterization procedure. Further, each model is hardware-validated to ensure its fidelity in predicting device behavior observed in experimental measurements. The models are also subjected to exercise in application circuits as a way of ascertaining and addressing any numerical convergence issues.
Compact Models
Researchers

Shamim Ahmed
Origin: Bangladesh
Candidate for Ph.D. in Electrical Engineering
B.Sc. in Electrical & Electronic Engineering
Bangladesh University of Engineering & Technology
Areas of interest: Wide band-gap semiconductor devices, device modeling/design and characterization, high temperature and high voltage testing, device processing technology, CAD for IC design flow, SiC IC design, process development kit design, modeling of nano dimension FET.
Research: Shamim’s research includes characterization and modeling of SiC low and high power devices. Currently he is involved in a NSF project where his responsibility is to build a FET model based on BSIM3 for Raytheon high temperature SiC process. The model is to be used for integrated gate driver design. He was also involved in a high temperature gate driver design project. He characterized bare die MOSFET and diode for the project and provided models to the designer for circuit simulation.

Yusi Liu
Origin: China
Candidate for PhD in Electrical Engineering
Education: M.S in Electrical Engineering from Florida State University. B.S in Electrical Engineering from Hunan University.
Areas of Interest: Power electronics application in high power system.
Working Project: SiC Fault Current Limiter (FCL)
Thomas White
Origin: Arkansas
Candidate for MS in Microelectronics and Photonics
Education: B.S. Physics, Henderson State University, 2011. B.S. Marketing/ Transportation and Logistics, University of Arkansas, 2006
Areas of Interest: Device fabrication and characterization.
Working Project: Fabrication and characterization of GaAs and GaN Hall-Effect sensors for the use in solar inverts.

Staci Brooks
Origin: Arkansas
Candidate for MS in Microelectronics and Photonics
Education: B.S. Physics, Henderson State University.
Working Project: Device modeling/Simulation.

Umuhoza Janviere
Origin: Rwanda
Ph.D Student in Electrical Engineering, University of Arkansas
B.S Electrical Systems Engineering, University of Arkansas at Little Rock
Areas of interest: Power Electronics design, Grid-Connected Power Electronics Systems, Energy and data management, Communications, Embedded systems, and PCB layouts.
Research: Janviere is currently working on Smart-Grid-Power Node Lab Prototype (SGPN), one year project. This SGPN prototype is intended to:
- Provide general-purpose node to integrate DC and AC power and load resources in residential power systems.
- Provide standardized grid-side connection, with objective to make the system dispatchable from the grid side and uninterruptable on the customer side.
- Universal and bidirectional power ports on DC side connect to a variety of power resources.
- Network data interface for local and grid-area data access.
- Extend the value of grid-connected PV by providing backup power capability to the customer.

Yuzhi Zhang
Origin: China
Candidate for PhD in Electrical Engineering
Education: Xi’an University of Technology, Xi’an, China. MS in Electrical Engineering
Areas of Interest: Power electronic design and modeling.
Working Project: Currently working on Smart Green Power Node.
Sonia Perez
Origin: Arkansas
Candidate for MS in Microelectronics and Photonics
Education:BS Degree in Physics from Henderson State University
Areas of Interest: Device Modeling and Characterization
Project: SiC Device Modeling

Haoyan Liu
Origin: China
Candidate for MS in Electrical Engineering
Education: B.Sc in Automation, Harbin University of Science and Technology, China
Area of Interest: Power electronics, system modeling, and FPGA applications
Working Project: Grid-connected Advanced Power Electronic Systems